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2024-01-18dragonboards: Update vendor-package to 20240116 releaseAmit Pundir
Update to the 20240116 release. There is only one change in this package release which allows Venus, ADSP and CDSP firmware files to load successfully from a generic ramdisk, when we are booting AOSP from mmc-sdcard with upstream U-Boot (which only supports Android boot image header version v2). vendor-package binary: https://releases.devboardsforandroid.linaro.org/vendor-packages/20240116/extract-linaro_devices-20240116.tgz vendor-package source: https://source.devboardsforandroid.linaro.org/linaro-vendor-package/ Signed-off-by: Amit Pundir <amit.pundir@linaro.org> Change-Id: I887b1044c57c53abbe20760d59b28f93df77a987
2023-05-11dragonboards: Update vendor-package to 20230510 releaseAmit Pundir
Update to the 20230510 release, which update mesa prebuilt binaries to mesa-23.0.2 release tag. Note: These binaries are built with android13-gsi branch because the binaries built with AOSP (as of 13-April-2023) ain't stable and are running into crashes like this one, https://gitlab.freedesktop.org/mesa/mesa/-/issues/8776, which can be reproduced by running "atest CtsUiRenderingTestCases" as well. vendor-package binary: https://releases.linaro.org/android/aosp-linaro-vendor-package/extract-linaro_devices-20230510.tgz vendor-package source: https://gitlab.com/LinaroLtd/linaro-aosp/linaro-vendor-package/-/commits/master Change-Id: I6b54cd04039b4cd05cd80e7da4dfa371b7154558 Signed-off-by: Amit Pundir <amit.pundir@linaro.org>
2022-12-07dragonboards: Update vendor-package to 20221126 releaseAmit Pundir
Update to the 20221126 release, which update mesa prebuilt binaries to upstream commit c70eec86efd9 (st/vdpau: fix interop with GL). Note: mesa/main build, however, is broken due to deprecated libbacktrace in AOSP https://gitlab.freedesktop.org/mesa/mesa/-/issues/7465 and has a hard dependency on meson version >= 0.54 now. vendor-package binary: https://releases.linaro.org/android/aosp-linaro-vendor-package/extract-linaro_devices-20221126.tgz vendor-package source: https://gitlab.com/LinaroLtd/linaro-aosp/linaro-vendor-package/-/commits/master Change-Id: Ibee137261ef247fe0248c58f9f47386826fdbdb5 Signed-off-by: Amit Pundir <amit.pundir@linaro.org>
2022-10-12dragonboards: Update vendor-package to 20221011 releaseAmit Pundir
Update to the 20221011 release, which: * Copy RB5 WiFi-BT firmware files to vendor-ramdisk.img to drop the dependency on user sysfs fw loader helper (FW_LOADER_USER_HELPER_FALLBACK). * Update mesa prebuilt binaries to upstream commit 55f6a2bb51a1 ("gallium: normalized_coords -> unnormalized_coords"). Note: mesa/main build, however, is broken due to deprecated libbacktrace in AOSP https://gitlab.freedesktop.org/mesa/mesa/-/issues/7465 vendor-package binary: https://releases.linaro.org/android/aosp-linaro-vendor-package/extract-linaro_devices-20221011.tgz vendor-package source: https://gitlab.com/LinaroLtd/linaro-aosp/linaro-vendor-package/-/commits/master Signed-off-by: Amit Pundir <amit.pundir@linaro.org> Change-Id: I3b790719605a2779afb8e55fc4f4a206602a654d
2022-07-26dragonboards: Update vendor-package to 20220726 releaseAmit Pundir
The 20220726 release fixes the recent AOSP build failures due to usage of deprecated "notice:" property in the vendor-package Android.bp files. vendor-package binary: https://releases.linaro.org/android/aosp-linaro-vendor-package/extract-linaro_devices-20220726.tgz vendor-package source: https://gitlab.com/Linaro/linaro-aosp/linaro-vendor-package/-/commits/master/ Signed-off-by: Amit Pundir <amit.pundir@linaro.org> Change-Id: I6d07eb42dcba90c8f0751dd9f054719085b4aa71
2022-06-29dragonboards: Update vendor-package to 20220629 releaseAmit Pundir
Update to the 20220629 release, which: * adds support for boot image header v4 in the bootloader * updates Mesa/main (commit: 42a4a123a6f5) based prebuilt binaries Signed-off-by: Amit Pundir <amit.pundir@linaro.org> Change-Id: Iff286cd2f2dabd565705b665f0b066c928fa4082
2022-03-04dragonboards: Update vendor-package to 20220303 releaseJohn Stultz
Update to the 20220303 release, which adds: * Mesa/main based prebuilt binaries * audio firmware path fixes for 5.4 Signed-off-by: John Stultz <john.stultz@linaro.org> Change-Id: I81b381e92df6119457ef6653752b10bb70d173c9
2022-02-15dragonboard: Update vendor-firmware-package to 20220210John Stultz
Update to usign the new vendor-firmware-package ver 20220210. This provides updates for firmware to support the unified build target (db845c) so it fully works on both db845c and rb5. Signed-off-by: John Stultz <john.stultz@linaro.org> Change-Id: Ieec85c62849592174a7bf3d76cfe3bc303ca5f4e
2022-01-28dragonboard: Add helper script to simplify fetching the correct vendor-packageJohn Stultz
Provide a script to help fetch, check and extract the vendor-package Signed-off-by: John Stultz <john.stultz@linaro.org> Change-Id: I928891d23841c103d31e7302d2bf667df6f24e66
2022-01-14dragonboards: Move firmware files to external vendor overlay packageAmit Pundir
Moving all the vendor binaries (including bootloader, qdl and firmware binaries) to an external vendor.tgz package to be downloaded from: https://releases.linaro.org/android/aosp-linaro-vendor-package/extract-linaro_devices-20220106.tgz BUILD_BROKEN_ELF_PREBUILT_PRODUCT_COPY_FILES build flag is used to copy a few vendor firmware files to ramdisk or vendor_ramdisk to work-around the dependency of their drivers on FW_LOADER_USER_HELPER_FALLBACK kernel config. And for that we needed to bump up the boot and vendor_boot partition sizes as well. Also folded John's installer script changes into this patch. Change-Id: I1b46ee17f4a218c735e2ac8d81759364b3bf7332 Signed-off-by: Amit Pundir <amit.pundir@linaro.org> [Reworked to handle versioned vendor/linaro/<dev> paths] Signed-off-by: John Stultz <john.stultz@linaro.org>
generated by cgit v1.2.3 (git 2.25.1) at 2024-06-28 21:58:29 +0000