diff options
Diffstat (limited to 'include/drivers/nxp/ddr/dimm.h')
| -rw-r--r-- | include/drivers/nxp/ddr/dimm.h | 330 |
1 files changed, 330 insertions, 0 deletions
diff --git a/include/drivers/nxp/ddr/dimm.h b/include/drivers/nxp/ddr/dimm.h new file mode 100644 index 000000000..fcae17984 --- /dev/null +++ b/include/drivers/nxp/ddr/dimm.h @@ -0,0 +1,330 @@ +/* + * Copyright 2021 NXP + * + * SPDX-License-Identifier: BSD-3-Clause + * + */ + +#ifndef DIMM_H +#define DIMM_H + +#define SPD_MEMTYPE_DDR4 0x0C + +#define DDR4_SPD_MODULETYPE_MASK 0x0f +#define DDR4_SPD_MODULETYPE_EXT 0x00 +#define DDR4_SPD_RDIMM 0x01 +#define DDR4_SPD_UDIMM 0x02 +#define DDR4_SPD_SO_DIMM 0x03 +#define DDR4_SPD_LRDIMM 0x04 +#define DDR4_SPD_MINI_RDIMM 0x05 +#define DDR4_SPD_MINI_UDIMM 0x06 +#define DDR4_SPD_72B_SO_RDIMM 0x08 +#define DDR4_SPD_72B_SO_UDIMM 0x09 +#define DDR4_SPD_16B_SO_DIMM 0x0c +#define DDR4_SPD_32B_SO_DIMM 0x0d + +#define SPD_SPA0_ADDRESS 0x36 +#define SPD_SPA1_ADDRESS 0x37 + +#define spd_to_ps(mtb, ftb) \ + ((mtb) * pdimm->mtb_ps + ((ftb) * pdimm->ftb_10th_ps) / 10) + +#ifdef DDR_DEBUG +#define dump_spd(spd, len) { \ + register int i; \ + register unsigned char *buf = (void *)(spd); \ + \ + for (i = 0; i < (len); i++) { \ + print_uint(i); \ + puts("\t: 0x"); \ + print_hex(buf[i]); \ + puts("\n"); \ + } \ +} +#else +#define dump_spd(spd, len) {} +#endif + +/* From JEEC Standard No. 21-C release 23A */ +struct ddr4_spd { + /* General Section: Bytes 0-127 */ + unsigned char info_size_crc; /* 0 # bytes */ + unsigned char spd_rev; /* 1 Total # bytes of SPD */ + unsigned char mem_type; /* 2 Key Byte / mem type */ + unsigned char module_type; /* 3 Key Byte / Module Type */ + unsigned char density_banks; /* 4 Density and Banks */ + unsigned char addressing; /* 5 Addressing */ + unsigned char package_type; /* 6 Package type */ + unsigned char opt_feature; /* 7 Optional features */ + unsigned char thermal_ref; /* 8 Thermal and refresh */ + unsigned char oth_opt_features; /* 9 Other optional features */ + unsigned char res_10; /* 10 Reserved */ + unsigned char module_vdd; /* 11 Module nominal voltage */ + unsigned char organization; /* 12 Module Organization */ + unsigned char bus_width; /* 13 Module Memory Bus Width */ + unsigned char therm_sensor; /* 14 Module Thermal Sensor */ + unsigned char ext_type; /* 15 Extended module type */ + unsigned char res_16; + unsigned char timebases; /* 17 MTb and FTB */ + unsigned char tck_min; /* 18 tCKAVGmin */ + unsigned char tck_max; /* 19 TCKAVGmax */ + unsigned char caslat_b1; /* 20 CAS latencies, 1st byte */ + unsigned char caslat_b2; /* 21 CAS latencies, 2nd byte */ + unsigned char caslat_b3; /* 22 CAS latencies, 3rd byte */ + unsigned char caslat_b4; /* 23 CAS latencies, 4th byte */ + unsigned char taa_min; /* 24 Min CAS Latency Time */ + unsigned char trcd_min; /* 25 Min RAS# to CAS# Delay Time */ + unsigned char trp_min; /* 26 Min Row Precharge Delay Time */ + unsigned char tras_trc_ext; /* 27 Upper Nibbles for tRAS and tRC */ + unsigned char tras_min_lsb; /* 28 tRASmin, lsb */ + unsigned char trc_min_lsb; /* 29 tRCmin, lsb */ + unsigned char trfc1_min_lsb; /* 30 Min Refresh Recovery Delay Time */ + unsigned char trfc1_min_msb; /* 31 Min Refresh Recovery Delay Time */ + unsigned char trfc2_min_lsb; /* 32 Min Refresh Recovery Delay Time */ + unsigned char trfc2_min_msb; /* 33 Min Refresh Recovery Delay Time */ + unsigned char trfc4_min_lsb; /* 34 Min Refresh Recovery Delay Time */ + unsigned char trfc4_min_msb; /* 35 Min Refresh Recovery Delay Time */ + unsigned char tfaw_msb; /* 36 Upper Nibble for tFAW */ + unsigned char tfaw_min; /* 37 tFAW, lsb */ + unsigned char trrds_min; /* 38 tRRD_Smin, MTB */ + unsigned char trrdl_min; /* 39 tRRD_Lmin, MTB */ + unsigned char tccdl_min; /* 40 tCCS_Lmin, MTB */ + unsigned char res_41[60-41]; /* 41 Rserved */ + unsigned char mapping[78-60]; /* 60~77 Connector to SDRAM bit map */ + unsigned char res_78[117-78]; /* 78~116, Reserved */ + signed char fine_tccdl_min; /* 117 Fine offset for tCCD_Lmin */ + signed char fine_trrdl_min; /* 118 Fine offset for tRRD_Lmin */ + signed char fine_trrds_min; /* 119 Fine offset for tRRD_Smin */ + signed char fine_trc_min; /* 120 Fine offset for tRCmin */ + signed char fine_trp_min; /* 121 Fine offset for tRPmin */ + signed char fine_trcd_min; /* 122 Fine offset for tRCDmin */ + signed char fine_taa_min; /* 123 Fine offset for tAAmin */ + signed char fine_tck_max; /* 124 Fine offset for tCKAVGmax */ + signed char fine_tck_min; /* 125 Fine offset for tCKAVGmin */ + /* CRC: Bytes 126-127 */ + unsigned char crc[2]; /* 126-127 SPD CRC */ + + /* Module-Specific Section: Bytes 128-255 */ + union { + struct { + /* 128 (Unbuffered) Module Nominal Height */ + unsigned char mod_height; + /* 129 (Unbuffered) Module Maximum Thickness */ + unsigned char mod_thickness; + /* 130 (Unbuffered) Reference Raw Card Used */ + unsigned char ref_raw_card; + /* 131 (Unbuffered) Address Mapping from + * Edge Connector to DRAM + */ + unsigned char addr_mapping; + /* 132~253 (Unbuffered) Reserved */ + unsigned char res_132[254-132]; + /* 254~255 CRC */ + unsigned char crc[2]; + } unbuffered; + struct { + /* 128 (Registered) Module Nominal Height */ + unsigned char mod_height; + /* 129 (Registered) Module Maximum Thickness */ + unsigned char mod_thickness; + /* 130 (Registered) Reference Raw Card Used */ + unsigned char ref_raw_card; + /* 131 DIMM Module Attributes */ + unsigned char modu_attr; + /* 132 RDIMM Thermal Heat Spreader Solution */ + unsigned char thermal; + /* 133 Register Manufacturer ID Code, LSB */ + unsigned char reg_id_lo; + /* 134 Register Manufacturer ID Code, MSB */ + unsigned char reg_id_hi; + /* 135 Register Revision Number */ + unsigned char reg_rev; + /* 136 Address mapping from register to DRAM */ + unsigned char reg_map; + unsigned char ca_stren; + unsigned char clk_stren; + /* 139~253 Reserved */ + unsigned char res_139[254-139]; + /* 254~255 CRC */ + unsigned char crc[2]; + } registered; + struct { + /* 128 (Loadreduced) Module Nominal Height */ + unsigned char mod_height; + /* 129 (Loadreduced) Module Maximum Thickness */ + unsigned char mod_thickness; + /* 130 (Loadreduced) Reference Raw Card Used */ + unsigned char ref_raw_card; + /* 131 DIMM Module Attributes */ + unsigned char modu_attr; + /* 132 RDIMM Thermal Heat Spreader Solution */ + unsigned char thermal; + /* 133 Register Manufacturer ID Code, LSB */ + unsigned char reg_id_lo; + /* 134 Register Manufacturer ID Code, MSB */ + unsigned char reg_id_hi; + /* 135 Register Revision Number */ + unsigned char reg_rev; + /* 136 Address mapping from register to DRAM */ + unsigned char reg_map; + /* 137 Register Output Drive Strength for CMD/Add*/ + unsigned char reg_drv; + /* 138 Register Output Drive Strength for CK */ + unsigned char reg_drv_ck; + /* 139 Data Buffer Revision Number */ + unsigned char data_buf_rev; + /* 140 DRAM VrefDQ for Package Rank 0 */ + unsigned char vrefqe_r0; + /* 141 DRAM VrefDQ for Package Rank 1 */ + unsigned char vrefqe_r1; + /* 142 DRAM VrefDQ for Package Rank 2 */ + unsigned char vrefqe_r2; + /* 143 DRAM VrefDQ for Package Rank 3 */ + unsigned char vrefqe_r3; + /* 144 Data Buffer VrefDQ for DRAM Interface */ + unsigned char data_intf; + /* + * 145 Data Buffer MDQ Drive Strength and RTT + * for data rate <= 1866 + */ + unsigned char data_drv_1866; + /* + * 146 Data Buffer MDQ Drive Strength and RTT + * for 1866 < data rate <= 2400 + */ + unsigned char data_drv_2400; + /* + * 147 Data Buffer MDQ Drive Strength and RTT + * for 2400 < data rate <= 3200 + */ + unsigned char data_drv_3200; + /* 148 DRAM Drive Strength */ + unsigned char dram_drv; + /* + * 149 DRAM ODT (RTT_WR, RTT_NOM) + * for data rate <= 1866 + */ + unsigned char dram_odt_1866; + /* + * 150 DRAM ODT (RTT_WR, RTT_NOM) + * for 1866 < data rate <= 2400 + */ + unsigned char dram_odt_2400; + /* + * 151 DRAM ODT (RTT_WR, RTT_NOM) + * for 2400 < data rate <= 3200 + */ + unsigned char dram_odt_3200; + /* + * 152 DRAM ODT (RTT_PARK) + * for data rate <= 1866 + */ + unsigned char dram_odt_park_1866; + /* + * 153 DRAM ODT (RTT_PARK) + * for 1866 < data rate <= 2400 + */ + unsigned char dram_odt_park_2400; + /* + * 154 DRAM ODT (RTT_PARK) + * for 2400 < data rate <= 3200 + */ + unsigned char dram_odt_park_3200; + unsigned char res_155[254-155]; /* Reserved */ + /* 254~255 CRC */ + unsigned char crc[2]; + } loadreduced; + unsigned char uc[128]; /* 128-255 Module-Specific Section */ + } mod_section; + + unsigned char res_256[320-256]; /* 256~319 Reserved */ + + /* Module supplier's data: Byte 320~383 */ + unsigned char mmid_lsb; /* 320 Module MfgID Code LSB */ + unsigned char mmid_msb; /* 321 Module MfgID Code MSB */ + unsigned char mloc; /* 322 Mfg Location */ + unsigned char mdate[2]; /* 323~324 Mfg Date */ + unsigned char sernum[4]; /* 325~328 Module Serial Number */ + unsigned char mpart[20]; /* 329~348 Mfg's Module Part Number */ + unsigned char mrev; /* 349 Module Revision Code */ + unsigned char dmid_lsb; /* 350 DRAM MfgID Code LSB */ + unsigned char dmid_msb; /* 351 DRAM MfgID Code MSB */ + unsigned char stepping; /* 352 DRAM stepping */ + unsigned char msd[29]; /* 353~381 Mfg's Specific Data */ + unsigned char res_382[2]; /* 382~383 Reserved */ +}; + +/* Parameters for a DDR dimm computed from the SPD */ +struct dimm_params { + /* DIMM organization parameters */ + char mpart[19]; /* guaranteed null terminated */ + + unsigned int n_ranks; + unsigned int die_density; + unsigned long long rank_density; + unsigned long long capacity; + unsigned int primary_sdram_width; + unsigned int ec_sdram_width; + unsigned int rdimm; + unsigned int package_3ds; /* number of dies in 3DS */ + unsigned int device_width; /* x4, x8, x16 components */ + unsigned int rc; + + /* SDRAM device parameters */ + unsigned int n_row_addr; + unsigned int n_col_addr; + unsigned int edc_config; /* 0 = none, 1 = parity, 2 = ECC */ + unsigned int bank_addr_bits; + unsigned int bank_group_bits; + unsigned int burst_lengths_bitmask; /* BL=4 bit 2, BL=8 = bit 3 */ + + /* mirrored DIMMs */ + unsigned int mirrored_dimm; /* only for ddr3 */ + + /* DIMM timing parameters */ + + int mtb_ps; /* medium timebase ps */ + int ftb_10th_ps; /* fine timebase, in 1/10 ps */ + int taa_ps; /* minimum CAS latency time */ + int tfaw_ps; /* four active window delay */ + + /* + * SDRAM clock periods + * The range for these are 1000-10000 so a short should be sufficient + */ + int tckmin_x_ps; + int tckmax_ps; + + /* SPD-defined CAS latencies */ + unsigned int caslat_x; + + /* basic timing parameters */ + int trcd_ps; + int trp_ps; + int tras_ps; + + int trfc1_ps; + int trfc2_ps; + int trfc4_ps; + int trrds_ps; + int trrdl_ps; + int tccdl_ps; + int trfc_slr_ps; + + int trc_ps; /* maximum = 254 ns + .75 ns = 254750 ps */ + int twr_ps; /* 15ns for all speed bins */ + + unsigned int refresh_rate_ps; + unsigned int extended_op_srt; + + /* RDIMM */ + unsigned char rcw[16]; /* Register Control Word 0-15 */ + unsigned int dq_mapping[18]; + unsigned int dq_mapping_ors; +}; + +int read_spd(unsigned char chip, void *buf, int len); +int crc16(unsigned char *ptr, int count); +int cal_dimm_params(const struct ddr4_spd *spd, struct dimm_params *pdimm); + +#endif /* DIMM_H */ |